Showa Denko Materials’ “MCL-E-795G,” an Advanced Functional Laminate Material for Printed Wiring Boards, Receives “The 18th JPCA Award”

Highly Rated for Low Warpage and High Heat Resistance

June 10, 2022

Showa Denko Materials Co., Ltd.

Showa Denko Materials Co., Ltd. (President and CEO: Hidehito Takahashi; hereinafter “Showa Denko Materials”) is pleased to announce that the Company’s MCL-E-795G*1 series, an advanced functional laminate material for printed wiring boards, has received “the 18th JPCA Award” from Japan Electronics Packaging and Circuits Association (hereinafter “JPCA”) because of the product’s high reputation in its technological advantages including low warpage and high heat resistance.

Showa Denko Materials developed MCL-E-795G combining high elastic modulus with low CTE properties enabling warpage reduction of 15 to 20 percent than those of our conventional products. In addition, MCL-E-795G has high heat resistance by adopting thermal shock and external stress-resistant resin into its main structure. As a result, when MCL-E-795G is used as printed wiring boards for high-density, high-performance semiconductor packages in large servers for data centers, it can improve yields of our customers’ production processes and contribute to high functionality of printed wiring boards.

JPCA Awards was created in order to praise products and technologies that contribute to progress in electronic circuit technology and industry. Selection for JPCA Awards is conducted by JPCA Awards Selection Committee which consists of representatives from academia, electronic circuit industry, electronic journal, etc. The Committee selects award winners in accordance with selection criteria such as (1) originality, (2) possibility of future growth in the industry, (3) reliability, and (4) fitness to the times. Therefore, being selected as JPCA Award winner means that the value and superiority of selected product or technology is recognized by the industry, and award winners will be known to the world.

This is the 11th time for Showa Denko Materials to receive JPCA Award. The awards ceremony will be held at 16:00, Wednesday, June 15, 2022 in the venue for JPCA Show 2022, and Showa Denko Materials will have a presentation to introduce MCL-E-795G on the next day.

During JPCA Show 2022, Showa Denko Materials will exhibit MCL-E-795G at the Company’s booth (Booth number: 5D-04), and will display panels concerning the product at the JPCA Awards Section in the venue for the Show.

 

“New Product Introduction Presentation” on MCL-E-795G at JPCA 2022
Theme:        Introduction of MCL-E-795G: High Modulus Low CTE Material for Printed Wiring Boards
Date/time:  Starting at 12:55, Thursday, June 16, 2022
Venue:         Venue 1, New Products Introduction (NPI) Seminar, JPCA Show 2022 (East Exhibition Hall 4, Tokyo Big Sight)
Presenter:   Tsutomu Sato, Staff Engineer, Laminate Materials R&D Department,
                    Information and Communication R&D Center, Information and Communication Business Headquarters,
                    Showa Denko Materials Co., Ltd.
Contents of the lecture:
  Achieving higher density in semiconductor packages requires enhanced packaging reliability of printed wiring boards for semiconductor packages as well as reduced substrate warpage caused by the thermal expansion difference between semiconductor chips and substrate materials in packaging process. In addition, high heat resistance is also essential for substrate materials because many customers have introduced soldering at high reflow*2 temperatures in their semiconductor package manufacturing processes. To overcome these challenges and realize low warpage and high heat resistance, Showa Denko Materials has developed MCL-E-795G, which is a highly elastic, heat resistant functional laminate material for printed wiring boards. Coefficient of thermal expansion of MCL-E-795G is lower than those of our conventional products, resulting in a 15 to 20 percent warpage reduction. Thus MCL-E-795G achieves low warpage and high thermal resistance simultaneously. We expect that demand of MCL-E-795G will grow as the needs of high performance semiconductor packages grow and package size becomes larger and thicker.

 

 

■Outline of Showa Denko Materials’ exhibition at JPCA Show 2022 
 (The 51st Total Solution Exhibition for Electronic Equipment)

 

Period 10:00 - 17:00, from Wednesday, June 15 to Friday, June 17, 2022
Venue Booth 5D-04, East Exhibition Hall 5, Tokyo Big Sight
Exhibited products Materials for printed wiring boards for semiconductor packages Materials for printed wiring boards for ICT infrastructure/IoT Materials for printed wiring boards for advanced driver-assistance systems (ADAS) Photosensitive materials for fine patterning Photosensitive insulating materials for semiconductor packaging Introduction of Packaging Solution Center

Package substrate using MCL-E-795G

 

  • ※1 News Release: For details, please refer to Showa Denko Materials’ news release “Showa Denko Materials to Launch the Mass Production of “MCL-E-795G,”
    an Advanced Functional Laminate Material for Printed Wiring Boards with High Packaging Reliability” announced on October 6, 2021.
    https://www.mc.showadenko.com/news/detail/english/31
  • ※2 Reflow refers to a method of mounting semiconductor packages by melting solder attached to printed wiring boards.

 

For further information, contact

Public Relations Group, Brand Communication Department