Technical Report No.54/March 2012

Full Contents

Preface

• Hitachi Chemical’s R&D Strategy
  –Contributing to Society by Developing Superior Technologies and Products to Pioneer a New Era– (PDF format, 417kBytes)

Review

• Thermal Management Materials (PDF format, 1,095kBytes)
• Recent Technology of Powder Metallurgy and Applications (PDF format, 1,745kBytes)

Report

• Thermally Conductive Metal Substrate (PDF format, 517kBytes)
• Thermally Conductive Flexible Substrate with Heat-resistant Adhesive Layer (PDF format, 598kBytes)
• Helical-groove Bearing with Long Life for Fan Motors (PDF format, 498kBytes)
• Sintered Heat Resistant Material for Turbochargers (PDF format, 502kBytes)
• Photosensitive Solder Resist Film for Semiconductor Package “FZ Series” (PDF format, 638kBytes)
• Reliability of Cu Wire Packages and Molding Compounds (PDF format, 545kBytes)
• Techniques for Analyzing Underfill Materials for Semiconductor Packages (PDF format, 696kBytes)
• Halogen Free, High Elasticity and Low CTE Multilayer Material「MCL-E-700G(R)」 (PDF format, 488kBytes)
• Anti-Fingerprint UV Curable Hard Coatings (PDF format, 536kBytes)
• Application of Layer-by-layer Assembled Nanoparticles to Anti-reflection Film (PDF format, 614kBytes)

Back number

• Technical Report No.62／March 2020
• Technical Report No.61／March 2019
• Technical Report No.60／March 2018
• Technical Report No.59／March 2017
• Technical Report No.58／March 2016
• Technical Report No.57／March 2015
• Technical Report No.56／March 2014
• Technical Report No.55／May 2013
• Technical Report No.54／March 2012