Cleaning Sheet for Semiconductor Encapsulation Molding DieN-CS Series
N-CS series is sheet type cleaning materials which removes stains from molding die for semiconductor encapsulation. With higher cleaning performance, it can reduce the time to clean-up molding die, compared with conventional cleaning compounds.
- N-CS series can reduce the time to clean-up molding die.
- N-CS provides good solution for burrs on surface of molding die, stains from gas and blocking of air vent.
- As N-CS series are environment safety materials, there is less noxious fumes, contamination and corrosion of molding die after cleaning.
How to Use
(1)Put the sheet on the molding die.
(2)Compress and mold.
(3)Open the die and remove the sheet.
|Item||Cleaning sheet||Wax sheet|
|Features||Cleaning + Recovery of releasability||Low temp. cleaning||Good cleaning performance + Easy to peel off from die||Applicable for all compounds|
- Tentative data after 300 shot of continuous molding with our green compounds
N-CS W type -High filling performance for small-sized cavity-
- N-CS W type completely fills cavity of mold die without air gap.
- N-CS W type is suitable for molding die with small cavity for small-sized semiconductor, diodes and mini transistor.
- N-CS W type is designed in a way that cavity is not blocked when the sheet is set on the mold die at any position.
- With N-CS W type, the air inside cavity can completely escape to outside and can remove off stains from the entire cavity.