Map Molding Support TapeRT Series

Image of RT Series

RT series is a supporting tape used in the map molding process of QFN and SON. Attaching on the reverse face of a lead frame, it has achieved no flush burr after molding and high productivity in wire bonding. The applications has been expanded to new packages besides QFN and SON.

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  • Thermoplastic resin with high thermal stability for adhesive layer.
  • Good wire bondability.
  • No flash burr after molding.
  • No Adhesive on a lead frame after detaping.
  • Low adhesiveness of the tape at room temperature achieves no dust attachment.

Characteristics (Typical Values)

Item Unit RT-321 RT-321-CD1
Features Standard Higher adhesion
for Ni/Pd/Au
Bonding temp. ºC 200~250 190~250
Detaping temp.* ºC 25~200 25~200
Tg ºC 220 190
Flash burr after molding None None
Residue after detaping None None
Adhesive strength to Ni/Pd/Au N/m 50 100
Heating is required for some lead frames and epoxy molding compounds.