Liquid EncapsulantsCEL-C Series

Image of CEL-C Series

We develop various types of liquid encapsulants along with cutting-edge packaging trend, TCP, COF, FCBGA, wafer level CSP and so on.

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Features

  • Excellent moisture resistance & electrical properties.
  • Excellent adhesion to the various types of substrates.
  • Low ionic impurities.
  • Minimum warpage by low CTE.

Features and Characteristics (Typical Values)

Applications Products Features Curing Conditions
(°C/h)
COF
(Underfill)
CEL-C-3900
Series
It is a non-filler type material, excellent impregnation and migration resistance. 120ºC/15min+
150ºC/1h
FC-BGA
(Underfill)
CEL-C-3730
Series
It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp. 150ºC/2h or
165ºC/2h