Liquid EncapsulantsCEL-C Series
We develop various types of liquid encapsulants along with cutting-edge packaging trend, TCP, COF, FCBGA, wafer level CSP and so on.
- Excellent moisture resistance & electrical properties.
- Excellent adhesion to the various types of substrates.
- Low ionic impurities.
- Minimum warpage by low CTE.
Features and Characteristics (Typical Values)
|It is a non-filler type material, excellent impregnation and migration resistance.||120ºC/15min+
|It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp.||150ºC/2h or