Photosensitive Solder ResistSR7300 / SR-F Series

Image of SR7300 / SR-F Series

Photosensitive solder resist, SR7300/SR-F, are optimized for package substrate.

Contact Us

Features

  • Low warpage by low CTE and low shrinkage, contributing to assembly and excellent reliability (HAST, TCT crack and Reflow resistance) of semiconductor PKG substrates.
  • Excellent resolution, contributing to higher functionality and miniaturization of semiconductor PKG substrates.
  • SR7300 is liquid type solder resist, SR-F is film type solder resist.

Properties

(One of our data)

Item Condition Unit SR7300
SR-F
Resolution 20 µm thickness µmΦ 50
Tg TMA 130 -140
CTE α1 ppm/℃ 38
Elastic modulus DMA, 23℃ MPa 5,000
Tensile strength S-S, 23℃ MPa 95
Elongation S-S, 23℃ % 4.2
Adhesion with copper 90°peel
(on CZ treatment)
N/m >0.6
Td (5% weight loss) TG-DTA 346

* Available upon request for film thickness

  • Thermal cycle test

TEST vehicle

TEST vehicle

Reflow 10 times After 1000 cycle After 2000 cycle After 3000cycle
Continuity
check
CSAM Continuity
check
CSAM Continuity
check
CSAM Continuity
check
CSAM
SR7300 / SR-F Pass Pass Pass Pass Pass Pass Pass Pass
conventional Pass Pass Pass Pass Pass Pass NG NG

*CSAM:Constant-depth mode Scanning Acoustic Microscope