Photosensitive Solder Resist for Package Substrates
SR7300/SR-F Series
About the product
Resonac’s photosensitive solder resist materials protect and insulate high-density wiring used for semiconductor packages.
Resonac boasts a large market share in the field of semiconductor packages using flip-chip packaging.
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Merits
- Realizes low warpage due to low CTE and low shrinkage.
- Contributes to higher density semiconductor packages due to high resolution.
- Contributes to high reliability (TCT and reflow resistance, etc.) due to high heat resistance.
- Offers the liquid type SR7300 and film type SR-F series.
Characteristics
| Item | Condition | Unit | SR7300 SR-F |
|---|---|---|---|
| Resolution | 20 µm thickness | µmΦ | 50 |
| Tg | TMA | ℃ | 130 -140 |
| CTE | α1 | ppm/℃ | 38 |
| Elastic modulus | DMA, 23℃ | MPa | 5,000 |
| Tensile strength | S-S, 23℃ | MPa | 95 |
| Elongation | S-S, 23℃ | % | 4.2 |
| Adhesion with copper | 90°peel (on CZ treatment) |
N/m | >0.6 |
| Td (5% weight loss) | TG-DTA | ℃ | 346 |
- ※ Available upon request for film thickness
- Thermal cycle test
| Reflow 10 times | After 1000 cycle | After 2000 cycle | After 3000cycle | |||||
|---|---|---|---|---|---|---|---|---|
| Continuity check |
CSAM | Continuity check |
CSAM | Continuity check |
CSAM | Continuity check |
CSAM | |
| SR7300 / SR-F | Pass | Pass | Pass | Pass | Pass | Pass | Pass | Pass |
| conventional | Pass | Pass | Pass | Pass | Pass | Pass | NG | NG |
- ※ CSAM:Constant-depth mode Scanning Acoustic Microscope
TEST vehicle
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