Photosensitive Film for Thick Film Resist Formation

Photec HM Series

About the product

Resonac’s photosensitive materials designed to form thick resist pattern layers are used for such applications as the copper plating process of printed wiring boards requiring a high aspect ratio and electroforming in metal mask manufacturing.

Image of HM Series for Thick Resist Layer

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Merits

  • Superior resolution/adhesion, and is capable of forming resists with a thickness more than double the hole diameter and line width.
  • Offers a thick film lineup (35-168 um) in response to various applications.
  • Superior chemical resistance, and applicable as a resist for copper plating and electroplating.
  • Responds to development with standard sodium carbonate solutions and peeling solutions used for printed wiring boards.
  • Provides smooth sidewall shapes.

Characteristics

(One of our data)

Item Unit HM-4000series
(For Contact Exposure)
HM-4056 HM-4075 HM-40112
Resist thickness µm 56 75 112
Exposure energy mJ/cm2 85 130 270
Extra high pressure mercury lamp*1
Adhesion(L/S=x/400) µm 22 35 32
Resolution(L/S=x/x) µm 25 35 50
  • ※1 Collimated light type

 

Resist profile

HM-4056
Resist thickness:56 µm
Φ=30 µm

HM-40112
Resist thickness:112 µm
L/S=180 µm/30 µm

HM-40112
Resist thickness:112 µm
Resist diameter:Φ=30 µm (Space:40 µm)

 

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