Anisotropic Conductive Films <ANISOLM> for IC chip

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This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and IC chip.

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Applications

Interconnection between LCD and driver IC

Features

  • Microscopic bump applicable
  • High adhesion and high reliability
  • Low contact resistance
  • Short bonding time
  • For low stress

Characteristics

Item Unit AC-8000 series
Application for IC chip
Fine pitch capability Min. contact area μm2 600
Min. space μm 10
Bonding
condition
Temp. ºC 140~
Time sec 5~
Pressure MPa 40~*
*
Based on electrode area