Thermal Conductive Sheets for Semiconductor Packages
TC Series
About the product
Resonac’s thermal conductive sheets (TIM material) with electrical conductivity efficiently release heat from IC chips when applied a semiconductor package, and between IC chip and a heat spreader, heatsink or heat pipe.
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Merits
- Achieves high thermal conductivity in the thickness direction by vertically aligned graphite fillers.
- Increases thermal conductivity by flexibly filling in gaps caused by differences in chip heights or uneven adhesive interface.
- Possible to temporarily fix on heat modules with slight adhesiveness.
- Applicable to next-generation large devices by flexibly fitting warped substrates.
Characteristics
Application example
Expected field of application
- The product’s superior thermal conductivity and cooling effect are expected to contribute to enhancing electronic device reliability and energy efficiency.
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