Stress-absorption prepreg for reducing solder cracks - Increases reliability of assembled electronic system!
PCB stress absorption prepreg <TD-002>
Base Materials for PWBs
News & Updates
- 2022.05.16
- 2021.11.18
- 2021.10.06
- 2021.01.14
- Solution: AS-400HS
Our bonding film allows multilayer PTFE PCB’s speed up data center servers!
Low-transmission-loss bonding film <AS-400HS>- 2020.10.12
Sort by application
Appli- cation |
Series | Features | Tg |
CTE (x, y) |
CTE (z) |
Dk |
Df |
CCL | Prepreg | Other |
---|---|---|---|---|---|---|---|---|---|---|
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NEWMCL-E-795G | -Lowest CTE with highest modulus | 260–290 | 3–5 | 10–15 | 4.2–4.4 | 0.006–0.008 | 〇 | 〇 | × |
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MCL-E-770G (Type R) | Low CTE with high modulus. | 260–280 | 4–6 | ‐ | 4.2–4.4 | 0.006–0.008 | 〇 | 〇 | × |
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STANDARDMCL-E-705G | -Low CTE with high modulus -Standard material in FC-BGA market |
250–270 | 5–7 | 10–15 | 4.4–4.6 | 0.009–0.011 | 〇 | 〇 | × |
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MCL-E-700G (Type R) | Low CTE with high modulus and high Tg properties | 250–270 | 8–10 | 15–25 | 4.6–4.8 | 0.008–0.010 | 〇 | 〇 | × |
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MCL-E-679FG | Low CTE with high modulus and high Tg properties | 165–175 | 13–15 | 23–33 | 4.5–4.7 | 0.018–0.020 | 〇 | 〇 | × |
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GEA-705G (Type F) | Ultra thin, flat prepreg with low CTE and high modulus prepreg for PKG | 250–270 | 8–10 | ‐ | ‐ | ‐ | × | 〇 | × |
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GEA-770G (Type F) | Ultra thin, flat prepreg with low CTE and high modulus prepreg for PKG | 260–280 | 6–7 | ‐ | ‐ | ‐ | × | 〇 | × |
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MCL-HS200 | Hybrid properties of Low CTE and low Dk, low Df for 5G and next generation PKG. | 220–240 | 8–10 | 25–35 | 3.2–3.4 | 0.0020–0.0030 | 〇 | 〇 | × |
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MCL-HS100 | Hybrid properties of Low CTE and low Dk, low Df for 5G and next generation PKG. | 240–260 | 6–8 | 20–30 | 3.5–3.7 | 0.0025–0.0035 | 〇 | 〇 | × |
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GH-200 (Type DF) | Thin, flat prepreg with hybrid properties of Low CTE and low Dk, low Df for 5G and next generation PKG. | 220–240 | 8–10 | ‐ | ‐ | 0.0020–0.0030 | × | 〇 | × |
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GH-100 (Type DF) | Ultra thin, flat prepreg with hybrid properties of Low CTE and low Dk, low Df for 5G and next generation PKG. | 240–260 | 6–8 | ‐ | ‐ | 0.0025–0.0035 | × | 〇 | × |
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MCL-LW-900G/910G | -Low Dk/Df with highly reliable performance. |
190–210 | 11–13 (Pull) |
35–45 | 3.2–3.4 | 0.0020–0.0030 | 〇 | 〇 | × |
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MCL-E-78G | Mid-loss grade material with high reliability. Suitable for hybrid construction. | 160–170 | 13–17 | 35–45 | 3.3–3.5 | 0.012–0.014 | 〇 | 〇 | × |
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MCL-HE-679G (Type S) | Mid-loss grade material with high reliability. | 180–190 | 12–17 | 30–40 | 3.6–3.8 | 0.007–0.009 | 〇 | 〇 | × |
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AS-400HS | -Low Dk/Df Resin film, Resin Coated Copper (RCC). -Good flexibility and adhesion with PTFE |
190–250 * | 80–110 | 20–45 | 2.9–3.1 | 0.0020–0.0030 | × | × | 〇 |
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PF-EL | Copper foil for fine patterning by semi-additive process (SAP) | 155–160 * | 70–75 | 70–75 | 3.0–3.2 | 0.020–0.022 | × | × | 〇 |
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TD-002 | Low elastic modulus for reducing solder crack | 155–170 | 6–9 | 80–130 | 3.6–3.8 * | 0.011–0.013 * | × | 〇 | × |
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MCL-I-671 | Non-MDA PI Resin system -No-flow prepreg available for high reliability |
200–215 | 12–15 | 50–80 | 4.1–4.3 * | 0.0130–0.0150 * | 〇 | 〇 | × |
* Measurement method: Tg (DMA)、Dk, Df @ 1 GHz