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Base Materials for PWBs
Multilayer Materials
Glass Epoxy Multilayer Material is superior in heat resistance and applicable to lead-free soldering process. A wide range of materials is available, such as low warpage, standard FR-4, high heat resistance, high insulation resistance, and halogen-free materials.
- MCL-HS200 (PDF format, 148kBytes)
- MCL-HS100 (PDF format, 124kBytes)
- GEA-705G Type(F), GEA-770G Type(F) (PDF format, 495kBytes)
- MCL-E-770G Type(R)
(PDF format, 147kBytes) - MCL-E-795G (PDF format, 105kBytes)
- MCL-E-705G (PDF format, 211kBytes)
- MCL-E-700G Type(R)
(PDF format, 492kBytes) - MCL-E-679FG (PDF format, 106kBytes)
- MCL-E-78G (PDF format, 91kBytes)
- TD-002 (PDF format, 144kBytes)
- MCL-E-75G (PDF format, 96kBytes)
Materials for ICT infrastructure
Selection of halogen free materials is available for high-layer count PWB with high heat resistance property for lead-free soldering process.
Materials for Fine Patterning
Copper foil suitable for fine line patterning by semi-additive process.
Polyimide Multilayer Material
Polyimide multilayer material MCL-I-671 is composed of low-temperature curing type glass modified polyimide resin which can be processed as conventional FR-4. Resin flow control technology enables production of high to low flow prepregs.
Low Loss Adhesive Film
Film material with excellent dielectric properties and adhesion to PTFE.
Precautionary Statement
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