Base Materials for PWBs

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2021.11.18
Stress-absorption prepreg for reducing solder cracks - Increases reliability of assembled electronic system!
PCB stress absorption prepreg <TD-002>
2021.10.06
2021.01.14
  • Solution: AS-400HS
    • Our bonding film allows multilayer PTFE PCB’s speed up data center servers!
    Low-transmission-loss bonding film <AS-400HS>
2020.10.12

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Appli-
cation		 Series Features

Tg
(TMA)

CTE (x, y)

CTE (z)

Dk
(10 GHz)

Df
(10 GHz)

 CCL Prepreg Other
Semiconductor PKG NEWMCL-E-795G -Lowest CTE with highest modulus 260–290 3–5 10–15 4.2–4.4 0.006–0.008 〇 〇 ×
Semiconductor PKG MCL-E-770G Type(R) Low CTE with high modulus. 260–280 4–6 ‐ 4.2–4.4 0.006–0.008 〇 〇 ×
Semiconductor PKG STANDARDMCL-E-705G -Low CTE with high modulus
-Standard material in FC-BGA market		 250–270 5–7 10–15 4.4–4.6 0.009–0.011 〇 〇 ×
Semiconductor PKG MCL-E-700G Type(R) Low CTE with high modulus and high Tg properties 250–270 8–10 15–25 4.6–4.8 0.008–0.010 〇 〇 ×
Semiconductor PKG MCL-E-679FG Low CTE with high modulus and high Tg properties 165–175 13–15 23–33 4.5–4.7 0.018–0.020 〇 〇 ×
Semiconductor PKG GEA-705G Type(F) Ultra thin, flat prepreg with low CTE and high modulus prepreg for PKG 250–270 8–10 ‐ ‐ ‐ × 〇 ×
Semiconductor PKG GEA-770G Type(F) Ultra thin, flat prepreg with low CTE and high modulus prepreg for PKG 260–280 6–7 ‐ ‐ ‐ × 〇 ×
Semiconductor PKGICT Infrastructure MCL-HS200 Hybrid properties of Low CTE and ultra low Dk, low Df for 5G and next generation PKG. 220–240 8–10 25–35 3.2–3.4 0.0020–0.0030 〇 〇 ×
Semiconductor PKGICT Infrastructure MCL-HS100 Hybrid properties of Low CTE and low Dk, low Df for 5G and next generation PKG. 240–260 6–8 20–30 3.5–3.7 0.0025–0.0035 〇 〇 ×
Semiconductor PKGICT Infrastructure GH-200 Type(DF) Ultra thin, flat prepreg with hybrid properties of Low CTE and ultra low Dk, low Df for 5G and next generation PKG. 220–240 8–10 ‐ ‐ 0.0020–0.0030 × 〇 ×
Semiconductor PKGICT Infrastructure GH-100 Type(DF) Ultra thin, flat prepreg with hybrid properties of Low CTE and ultra low Dk, low Df for 5G and next generation PKG. 240–260 6–8 ‐ ‐ 0.0025–0.0035 × 〇 ×
ICT Infrastructure MCL-LW-900G/910G -Low Dk/Df with highly reliable performance.
 190–210 11–13
(Pull)		 35–45 3.2–3.4 0.0020–0.0030 〇 〇 ×
ICT Infrastructure MCL-E-78G Mid-loss grade material with high reliability. Suitable for hybrid construction. 160–170 13–17 35–45 3.3–3.5 0.012–0.014 〇 〇 ×
ICT Infrastructure MCL-HE-679G Type(S) Mid-loss grade material with high reliability. 180–190 12–17 30–40 3.6–3.8 0.007–0.009 〇 〇 ×
ICT InfrastructureAntenna AS-400HS -Low Dk/Df Resin film, Resin Coated Copper (RCC).
-Good flexibility and adhesion with PTFE		 190–250 * 80–110 20–45 2.9–3.1 0.0020–0.0030 × × 〇
Semiconductor PKG PF-EL Copper foil for fine patterning by semi-additive process (SAP) 155–160 * 70–75 70–75 3.0–3.2 0.020–0.022 × × 〇
Automotive TD-002 Low elastic modulus for reducing solder crack 155–170 6–9 80–130 3.6–3.8 * 0.011–0.013 * × 〇 ×
ICT Infrastructure MCL-I-671 Non-MDA PI Resin system
-No-flow prepreg available for high reliability		 200–215 12–15 50–80 4.1–4.3 * 0.0130–0.0150 * 〇 〇 ×

* Measurement method: Tg (DMA)、Dk, Df @ 1 GHz

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