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News & Updates

  1. 2023.05.16 News Resonac to exhibit at JPCA 2023 (The Total Solution Exhibition for Electronic Equipment 2023)新規ウィンドウで開く
  2. 2022.09.15 News News Release: Showa Denko Materials to Invest 10 Billion Yen in Copper-Clad Laminate Production Facilities新規ウィンドウで開く
  3. 2021.11.18 News Solution: TD-002新規ウィンドウで開く Stress-absorption prepreg for reducing solder cracks - Increases reliability of assembled electronic system!
    PCB stress absorption prepreg <TD-002>

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Application Series Features Tg
（TMA）		 CTE（x, y） CTE（z） Dk
（10 GHz）		 Df
（10 GHz）		 CCL Prepreg Other
Semiconductor PKG NEW MCL-E-795G -Lowest CTE with highest modulus 260–290 3–5 10–15 4.2–4.4 0.0060～0.0030 〇 〇 ×
Semiconductor PKG MCL-E-770G (Type R) Low CTE with high modulus. 260–280 4–6 ‐ 4.2–4.4 0.0060～0.0080 〇 〇 ×
Semiconductor PKG STANDARD
MCL-E-705G 		-Low CTE with high modulus
-Standard material in FC-BGA market		 250–270 5–7 10–15 4.4–4.6 0.0090～0.0110 〇 〇 ×
Semiconductor PKG MCL-E-700G (Type R) Low CTE with high modulus and high Tg properties 250–270 8–10 15–25 4.6–4.8 0.0080～0.0100 〇 〇 ×
Semiconductor PKG MCL-E-679FG Low CTE with high modulus and high Tg properties 165–175 13–15 23–33 4.5–4.7 0.0180～0.0200 〇 〇 ×
Semiconductor PKG GEA-770G Ultra thin, flat prepreg with low CTE and high modulus prepreg 260–280 6–7 ‐ ‐ ‐ × 〇 ×
Semiconductor PKG GEA-705G Ultra thin, flat prepreg with low CTE and high modulus prepreg 250–270 8–10 ‐ ‐ ‐ × 〇 ×
Semiconductor PKG NEW MCF-770G (Type P) Low CTE adhesive film with primer 290～310 ※ 18～20 ‐ 3.2～3.3 0.0060～0.0080 × × 〇
Semiconductor PKG ICT Infrastructure Antenna NEW MCL-HD60/HD90 High Dk, low transmission loss material for antenna in packages 240 11/12 ‐ 6.2/9.2 0.0056/0.0050 〇 〇 ×
Semiconductor PKG ICT Infrastructure Antenna MCL-HS200 Hybrid properties of Low CTE and low Dk, low Df for 5G and next generation PKG. 220–240 8–10 25–35 3.2–3.4 0.0020–0.0030 〇 〇 ×
Semiconductor PKG ICT Infrastructure Antenna MCL-HS100 Hybrid properties of Low CTE and low Dk, low Df for 5G and next generation PKG. 240–260 6–8 20–30 3.5–3.7 0.0025–0.0035 〇 〇 ×
Semiconductor PKG ICT Infrastructure Antenna GH-200 (Type D) Thin, flat prepreg with hybrid properties of Low CTE and low Dk, low Df for 5G and next generation PKG. 220–240 8–10 ‐ 3.2～3.4 0.0025～0.0030 × 〇 ×
Semiconductor PKG ICT Infrastructure Antenna GH-100 (Type D) Ultra thin, flat prepreg with hybrid properties of Low CTE and low Dk, low Df for 5G and next generation PKG. 240–260 6–8 ‐ 3.5～3.7 0.0030～0.0035 × 〇 ×
Semiconductor PKG ICT Infrastructure Antenna NEW MCF-200HS Low transmission loss, low CTE adhesive film 250～270 ※ 35～40 ‐ 2.9～3.1 0.0030～0.0040 × × 〇
ICT Infrastructure Antenna NEW MCL-LW-990 (Type RFD) High Tg, ultra low transmission loss material for automotive millimeter-wave radars 175～205 8～11 35～45 3.0～3.3 0.0020～0.0043 〇 〇 ×
ICT Infrastructure MCL-LW-900G/910G -Low Dk/Df with highly reliable performance. 190–210 11–13
(Pull)		 35–45 3.2–3.4 0.0020–0.0030 〇 〇 ×
ICT Infrastructure MCL-E-78G Mid-loss grade material with high reliability. Suitable for hybrid construction. 160–170 13–17 35–45 3.3–3.5 0.0120～0.0140 〇 〇 ×
ICT Infrastructure MCL-HE-679G (Type S) Mid-loss grade material with high reliability. 180–190 12–17 30–40 3.6–3.8 0.0070～0.0090 〇 〇 ×
ICT Infrastructure Antenna AS-400HS -Low transmission loss adhesive film.
-Good flexibility and adhesion with PTFE.		 190–250 ※ 80–110 20–45 2.9–3.1 0.0020–0.0030 × × 〇
Semiconductor PKG PF-EL Copper foil for fine patterning by semi-additive process (SAP) 155–160 ※ 70–75 70–75 3.0–3.2 0.0200～0.0220 × × 〇
Automotive TD-002 Low elastic modulus for reducing solder crack 155–170 6–9 80–130 3.6–3.8 ※ 0.0110～0.0130 ※ × 〇 ×
ICT Infrastructure MCL-I-671 Non-MDA PI Resin system
-No-flow prepreg available for high reliability		 200–215 12–15 50–80 4.1–4.3 ※ 0.0130–0.0150 ※ 〇 〇 ×
  • ※ Measurement method: Tg (DMA)、Dk, Df @ 1 GHz