PF-EL

Copper Foil for Fine Patterning

About the product

  • Product
    Copper Foil

    PF-EL

  • Applications
    • Semiconductor package substrates
    • High density multi-layer PWB

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Features

  • PF-EL is a copper foil that is appropriate for fine line patterning with semi-additive process (SAP) using rough shapes of primer made with the copper profile.
  • PF-EL has high peel strength for plating copper.
  • High flexural modulus substrates with using prepregs.

Characteristics

Surface

Surface

PF-EL

Surface

PF-EL SP

Fine patterning with SAP

Fine patterning with SAP

Design
L/S=10/10 µm with PF-EL
(Exposure LDⅠ)

Fine patterning with SAP

Design
L/S=7/7 µm with PF-EL SP
(Exposure LDⅠ)

Fine patterning with SAP

Design
L/S=5/5 µm with PF-EL SP
(Exposure Stepper)

Copper peel strength

Copper peel strength
  • Sample: MCL-E-770G (Type R), Copper foil 1.5 µm with plating copper 20 µm

Plating copper peel strength

Plating copper peel strength
  • Sample: MCL-E-770G (Type R), plating copper 20 µm

Fine patterning process

Fine patterning process
Fine patterning process

Standard Specifications

Copper Foil

Part Number Copper Foil
Thickness (µm)
Special Surface
Treatment (µm)
Roughness (µm) Composition Process
PF-EL-12 12 4 Ra: 0.3–0.4
SAP ※1
Rz: 1.5–2.5
PF-EL-3 3 2, 4 Ra: 0.3–0.5 SAP ※1
MSAP ※2
Rz: 1.5–2.5
PF-EL-2 2 2, 4 Ra: 0.3–0.5
Rz: 1.5–2.5
PF-EL-1.5 1.5 2 Ra: 0.3–0.5
Rz: 1.5–2.5
PF-EL-1.5SP 1.5 2 Ra: 0.2–0.3
Rz: 1.0–2.0
  • ※1 After lamination of the material to the prepreg, the copper foil is etched out,and the special surface treatment with appropriate roughness made by a replica of the copper profile etched out remains on prepreg surface.This process is SAP using this replica.
  • ※2 Semi additive process using thin copper foil as seed layer for having E'less copper +copper on both patterming and via plating purpose.

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