TD-002
Reduction of Solder Crack/Low Elastic Modulus Material
About the product
- Product form
- Prepreg
-
TD-002
- Applications
- Electronic equipment for automobiles.
- Engine room set board.
- PCB on component packagings.
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Features
- Applied to PWB surface of standard material to absorb soldering stress and inhibit solder crack.
- Elastic modulus is 1/4 of that of standard FR-4.
- Enables to reduce solder crack without using high functional material by combining TD-002 with standard material.
Characteristics
Connection reliability of Pb-free solder [Thermal condition: -40 ℃ (30 min.)⇔125 ℃ (30 min.)]
- Solder crack of TD-002+FR-4 (Cross section, after 3000cycles.)
Elastic modulus
Mechanical drilling processing [After 3000 hits]
TD-002+FR-4
Appearance after drilling
- Conditions of mechanical drilling
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- Stack-up: 3 panels
- Revolution: 120 krpm
- Drill bit: φ 0.3 mm
- E/B: Al t0.15 mm
- Feeding speed: 2.4 m/min.
Prepreg
- ※1 Heating Rate: 10 ℃/min.
- ※2 Measured by cavity resonator.
- ※3 Refer to"Condition Note"
- ※ Above data are experimental results and not guaranteed.
Standard Specification
Prepreg
- ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0 %. Value changes depending on the press condition or inner layer pattern.
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