MCL-LW-900G/910G

Halogen Free, High Tg, Low Transmission Loss Multilayer Material

About the product

  • Product 
    CCL

    MCL-LW-900G/910G

    Prepreg

    GWA-900G/910G

  • Applications
    • High-speed computer, server
    • High-speed router
    • High frequency devices, antenna

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Features

  • MCL-LW-910G achieved low dielectric constant (3.3 at 10 GHz) and low dissipation factor (0.0028 at 10 GHz) using low Dk glass and HVLP copper.
  • Enables high-speed transmission/communication at 25 Gbps by low transmission loss properties.
  • Has excellent heat resistance and connection reliability.

Characteristics

Dielectric characterization results

Dielectric characterization results
Dielectric characterization results
Measurement Conditions
  • Method: Triplate-Line Resonator (JPCA-TM001)
  • Temperature & Humidity: 25℃/60%RH
  • Laminate Thickness (b): 1.6 mm (Signal-Ground: 800 µm), Trace thickness(t): 18 µm (RT, HVLP)
  • Signal Conductor Line Width(w): 1 mm (Zo: ca.50 Ω)
Measurement Conditions

Transmission Loss

Measurement conditions
  • Evaluation PWB: Strip-line
  • Temperature & Humidity: 25℃/60%RH
  • Characteristic impedance: Approx. 50 Ω
  • Inner layer surface treatment: Black-reduction
  • Proofreading method: TRL (Thru-Reflect-Line)
  • Trace width(w): 0.120 mm
  • Dielectric thickness(b): 0.25 mm
  • Trace thickness(t): 18 µm
Transmission Loss
Transmission Loss

Copper Clad Laminate

                                                                                                                                                                                                              (t0.8 mm)

Item Condition※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-LW-900G MCL-LW-910G
Tg TMA method A ℃ 190–210 2.4.24
DMA method A 220–260 ‐
CTE ※1 X (30–120℃) A ppm/℃ 12–15 ‐
Y (30–120℃) 12–15
Z (＜Tg) A 35–45 2.4.24
(＞Tg) A 230–280
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T-260 (Without Copper) A min. ≧60 2.4.24.1
T-288 (Without Copper) ≧60
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 410–450 2.3.40
Copper Peel Strength 18 µm RT A kN/m 0.4–0.7 2.4.8
18 µm HVLP 0.4–0.7
Flexural Modulus (Lengthwise) A GPa 16–21 2.4.4
 Dielectric Constant 10 GHz ※2 A － 3.6–3.8 3.2–3.4 IEC-62810
 Dissipation Factor 10 GHz ※2 A － 0.0040–0.0050 0.0025–0.0035
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.7
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐
  • ※1 Heating Rate: 10℃/min.(Comp.)
  • ※2 Measured by Cavity Resonator.
  • ※3 Refer to"Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Thickness Code Laminate Thickness
MCL-LW-900G
(E glass)

MCL-LW-910G
(Low Dk glass )		 ̶ 18 µm
35 µm
70 µm
(RT)

12 µm
18 µm
35 µm
(HVLP)		 M0.05 0.05mm
M0.06 0.06mm
M0.08 0.08mm
0.1 0.10mm
M0.11 0.10mm
0.13 0.13mm
M0.15 0.15mm
0.2 0.20mm
0.26 0.25mm

Note1) Laminate thicknessmeans dielectric layer thickness.

Prepreg 

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1 
GWA-900G 0.05 (1037N72) 1037 72±2 0.050 mm
0.06 (1078N64) 1078 65±2 0.078 mm
0.08 (3313N57) 3313 57±2 0.106 mm
0.1 (2116N55) 2116 55±2 0.125 mm
GWA-910G 0.05 (1037N74) 1037 74±2 0.050 mm
0.06 (1078N67) 1078 67±2 0.078 mm
0.08 (2013N59) 2013 59±2 0.106 mm
0.1 (2116N57) 2116 57±2 0.125 mm
Reference (IPC-TM-650) 2.3.16 ‐
  • ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.         Values change depending on the press condition or inner layer pattern.

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