MCL-I-671

Polyimide Multilayer Material

About the product

  • Product
    CCL

    MCL-I-671

    Prepreg

    GIA-671N

  • Applications
    • Main frame computers and super computers
    • Semiconductor testing equipment, and burn-in boards
    • Flex-rigid PWBs (No-flow prepreg)

Inquiry of this product

Inquiry form

Features

  • High Tg (>200℃: DMA) material for high through-hole reliability.
  • FR-4 lamination condition can be applied. (175℃, 90 min.)
  • MDA, a general polyimide resin curing agent, is not used. (Non-MDA Resin System)
  • Resin flow control technology enables from high to low flow.

Characteristics

Correlation between Dielectric Constant and Frequency

                                                                                                               (t0.8mm)

Correlation between Dielectric Constant and Frequency

Note) Measured by Triplate-line Resonator.

Correlation between Dissipation Factor and Frequency

                                                                                                                     (t0.8mm)

Correlation between Dissipation Factor and Frequency

Barcol Hardness

                                                                                                                    (t0.8mm)

Barcol Hardness

Water Absorption

PCT Condition: 121℃ 0.22MPa                                                              (t0.8mm)

Water Absorption

Thermal Shock Test MIL-STD-202

Method 107E

Thermal Shock Test MIL-STD-202

Flexural Strength

Flexural Strength

Copper Clad Laminate

                                                                                                                                                                                       (t0.8mm)

Item Condition ※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-I-671
Tg TMA method A ℃ 200–213 2.4.24
DMA method A 230–245 ‐
CTE ※1 X (30–120℃) A ppm/℃ 12–15 ‐
Y (30–120℃) 12–16
Z (＜Tg) A 50–80 2.4.24
(＞Tg) A 200–300
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T-260 (Without Copper) A min. ≧60 2.4.24.1
T-288 (Without Copper) ≧15
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 330–350 2.3.40
Copper Peel Strength　　(18 µm) 20℃ A kN/m 1.3–1.5 2.4.8
180℃ 1.0–1.2
Flexural Modulus (Lengthwise) A GPa 24–26 2.4.4
Dielectric Constant 1 MHz A － 4.2–4.4 2.5.5.9
1 GHz ※2 4.1–4.3 JPCA TM-001
Dissipation Factor 1 MHz A － 0.0110–0.0130 2.5.5.9
1 GHz ※2 0.0130–0.0150 JPCA TM-001
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐
  • ※1 Heating Rate: 10℃/min.(Comp.)
  • ※2 Measured by Triplate-line Resonator.
  • ※3 Refer to"Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Thickness Code Laminate Thickness
MCL-I-671 － 12 µm
18 µm
35 µm
70 µm		 0.06 0.06 mm
0.1 0.10 mm
0.2 0.20 mm
0.3 0.30 mm
0.4 0.40 mm
0.8 0.80 mm
1.0 1.00 mm
1.2 1.20 mm
1.6 1.60 mm

Note1) Laminatethickness means dielectric layer thickness.

Prepreg

Part Number Type Glass Cloth Properties Application
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1
GIA-671N (T) 0.03 106 72±3 0.059 mm MLB
0.05 1080 65±3 0.087 mm
0.1 2116 54±3 0.134 mm
(N) 0.03 106 68±3 0.047 mm Flex-rigid PWBs
0.05 1080 59±3 0.072 mm
(F) 0.05 1080 74±3 0.111 mm Metal core PWBs
Reference (IPC-TM-650) 2.3.16 ‐ ‐
  • ※1 The dielectric thickness after lamination is defined as the theoretical calculation thickness of one sheet of prepreg when the resin flow is 0%. Values change depending on the press condition or inner layer pattern. 
  •  

Inquiry of this product

Inquiry form