AS-400HS/MCF-400HS
Low Loss Adhesive Film
About the product
- Product
- Adhesive Film
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AS-400HS
- Resin Coated Copper
-
MCF-400HS
- Applications
- Antenna use
- High-speed PCB
Inquiry of this product
Features
- Excellent dielectric properties (Low transmission loss)
- Adaptable to multi layer press process.
- Good adhesion to PTFE
- Adaptable to interlaminate connection by laser IVH
Characteristics
Transmission Loss
Transmission Loss
Measurement Conditions
- Transmission structure： Micro-strip-line
- Temperature & Humidity： 25℃/40%RH
- Characteristic impedance： 50Ω
- Calibration method： TRL
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- Line width（w）：240 ～ 270μm
- Dielectric thickness(b): 100～130 μm
- Copper thickness (t）：30 μm（include plating）
C-stage
| Item | Conditon ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| AS-400HS/MCF-400HS | ||||||
| Storage Modulus (DMA method: 25℃) | A | Gpa | 3–5 | ‐ | ||
| Tg (DMA method) | A | ℃ | 190–250 | ‐ | ||
| CTE ※1 | Z | (＜Tg) | A | ppm/℃ | 20–45 | 2.4.24 |
| (＞Tg) | A | 35–75 | ||||
| Solder Heat Resistance (260℃) | A | sec. | ≧300 | ‐ | ||
| Copper Peel Strength | 18 µm HVLP | A | kN/m | 0.45–0.60 | 2.4.8 | |
| Dielectric Constant | 10 GHz ※2 | A | － | 2.9–3.1 | IEC-62810 | |
| Dissipation Factor | 10 GHz ※2 | A | － | 0.0020–0.0030 | ||
- ※1 Heating Rate: 10℃/min. (Comp.)
- ※2 Mesured by cavity resonator.
- ※3 Refer to"Condition Note"
B-stage
| Item | Conditon | Unit | Actual Value | Reference | |||||
| Volatile Content | 163℃ 15 min. weight method | wt% | ≦2 | － | |||||
Standard Specifications
| Part Number | Actual Thickness | Carrier Film Thickness | |||||
| AS-400HS | 25, 50, 65 μm | 50 μm(PET) | |||||
| MCF-400HS | 25, 50, 65 μm | 12, 18 μm(Cu foil:HVLP) | |||||
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