MCL-E-700G (Type R)
Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material
About the product
- Product
- CCL
-
MCL-E-700G (Type R)
- Prepreg
-
GEA-700G
- Applications
- Semiconductor packages (FC-BGA, FC-CSP, PoP, SiP)
- HDI, PWB
- Thinner Module PWB
Inquiry of this product
Features
- Has low CTE values in X, Y directions and reduces warpage of package substrate significantly.
- Well-suited for build-up construction.
- Good drill processability: lowers process cost.
Characteristics
Elastic Modulus
Amount of deflection by hole area
Warpage of FC-BGA
- TEG Chip
-
- Chip size: 20 mm×20 mm
- Chip thickness: 0.725 mm
- Bump diameter: 80 µm
- Bump pitch: 200 µm
- TEG Substrate
-
- Sub size: 35 mm×35 mm
- Core thikness: 0.7 mm
- Build up thickness: 30 µm×2
- SR thickness: 20 µm
Copper Clad Laminate
(t0.4mm)
| Item | Condition ※3 | Unit | Actual Value | Reference (IPC-TM-650) |
||
|---|---|---|---|---|---|---|
| MCL-E- 700G (Type R) |
||||||
| Tg | TMA method | A | ℃ | 250–270 | 2.4.24 | |
| DMA method | A | 295–305 | ‐ | |||
| CTE ※1 | X (30–120℃) | A | ppm/℃ | 8–10 | ‐ | |
| Y (30–120℃) | 8–10 | |||||
| Z ※4 | (＜Tg) | A | 15–25 | 2.4.24 | ||
| (＞Tg) | A | 90–120 | ||||
| Solder Heat Resistance (260℃) | A | sec. | ≧300 | ‐ | ||
| T-260 (Without Copper) | A | min. | ≧60 | 2.4.24.1 | ||
| T-288 (Without Copper) | ≧60 | |||||
| Decomposition Temperature (TGA method 5% Weight Loss) | A | ℃ | 430–450 | 2.3.40 | ||
| Heat Resistance for HDI Process (Semi-Additive) | 260℃ Reflow | cycle | ≧20 | ‐ | ||
| Copper Peel Strength | 12 µm | A | kN/m | 0.9–1.1 | 2.4.8 | |
| 18 µm | 1.0–1.2 | |||||
| Surface Roughness (Ra) | A | µm | 2–3 | 2.2.17 | ||
| Flexural Modulus (Lengthwise) ※4 | A | GPa | 32–34 | ‐ | ||
| Dielectric Constant | 10 GHz ※2 | A | － | 4.6–4.8 | ‐ | |
| Dissipation Factor | 10 GHz ※2 | A | － | 0.008–0.010 | ‐ | |
| Volume Resistivity | C-96/40/90 | Ω･cm | 1×1014–1×1016 | 2.5.17 | ||
| Surface Resistance | Ω | 1×1013–1×1015 | ||||
| Insulation Resistance | A | Ω | 1×1014–1×1016 | ‐ | ||
| D-2/100 | 1×1012–1×1014 | ‐ | ||||
- ※1 Heating Rate: 10℃/min.(Comp.)
- ※2 Measured by SPDR.
- ※3 Refer to"Condition Note"
- ※4 t0.8mm
- ※ Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
| Part Number | Type | Copper Foil Thickness | Code Name | Laminate thickness |
|---|---|---|---|---|
| MCL-E-700G | (R) | 2 , 3 , 12 µm (LP, PF) | U0.04 | 0.04 mm |
| U0.05 | 0.05 mm | |||
| T0.06 | 0.06 mm | |||
| (R) | 2 , 3, 12, 18 μm(LP) 2, 3, 12 μm(PF) 12 , 18 µm(STD) |
M0.06 | 0.06 mm | |
| 0.1 | 0.11 mm | |||
| M0.11 | 0.10 mm | |||
| M0.15 | 0.16 mm | |||
| M0.22 | 0.21 mm | |||
| 0.2 | 0.20 mm | |||
| 0.31 | 0.30 mm | |||
| 0.41 | 0.40 mm | |||
| 0.51 | 0.50 mm | |||
| 0.61 | 0.60 mm | |||
| 0.71 | 0.70 mm |
- Note1) STD: Standard copper foil, LP: Low profile copper foil, PF: Profile-free copper foil.
- Note2) ”U” for 1-ply, “T” for 2-ply.
- Note3) Laminate thickness means dielectric layer thickness.
Prepreg
| Part Number | Type | Glass Cloth | Properties | ||||
|---|---|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 |
|||||
| GEA-700G | (–) | 0.025 | (1017N74) | 1017 | 74±2 | 0.025 mm | |
| 0.03 | (1027N74) | 1027 | 74±2 | 0.040 mm | |||
| 0.04 | (1037N74) | 1037 | 74±2 | 0.048 mm | |||
| 0.06 | (1078N66) | 1078 | 66±2 | 0.071 mm | |||
| 0.1 | (2116N59) | 2116 | 59±2 | 0.127 mm | |||
| Reference (IPC-TM-650) | 2.3.16 | ‐ | |||||
- ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.Values change depending on the press condition or inner layer pattern.
Inquiry of this product