GH-100 (Type D), GH-200 (Type D)
Low Transmission Loss, Thin Prepreg with Superior Surface Smoothness
About the product
- Product
- Prepreg
-
GH-100 (Type D), GH-200 (Type D)
- Applications
- Semiconductor packages (FC-CSP, PoP, SiP)
- Thinner Module PWB
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Features
- GH-100 (Type D) and GH-200 (Type D) have hybrid properties of package and high speed materials.
- Good for impedance control as thickness variation is small after press.
- Halogen free material with low CTE values in X, Y directions (α1, α2).
- Good dielectric properties by applying low dielectric glass cloths.
Characteristics
Surface Smoothness of Prepreg (Microscope)
TYPE-F
Conventional
Panel Warpage of Prepreg after press (w/o copper, by shadow moire)
TYPE-F
Conventional
Prepreg thickness after Press
- Laminate condition
-
Sample
- GEA-705G1010F78
- Copper foil: 3 µm
- Temp.: 230℃100 min
- Heating rate: 3.0℃/min
- Pressure: 3 MPa
- Measurement method
-
Undulation of prepreg after press (GEA-705G1010F78)
TYPE-F
Conventional
Prepreg
| Item | Condition ※3 | Unit | Actual Value | Test Method | ||
|---|---|---|---|---|---|---|
| GH-100 (Type D) |
GH-200 (Type D) |
(IPC-TM-650) | ||||
| Tg | TMA method | A | ℃ | 240–260 | 220–240 | 2.4.24.5 |
| DMA method | A | 240–260 | 250–270 | - | ||
| CTE ※1 | X (30–120℃) | A | ppm/℃ | 13–15 | 14–16 | 2.4.24.5 |
| Y (30–120℃) | 13–15 | 14–16 | ||||
| T260 (Without Copper) | A | min. | ≧60 | ≧60 | 2.4.24.1 | |
| T288 (Without Copper) | ≧60 | ≧60 | ||||
| Dielectric Constant ※2 | 10 GHz | A | - | 3.3–3.5 | 3.2–3.4 | IEC-62610 |
| Dissipation Factor ※2 | 10 GHz | A | - | 0.0030–0.0050 | 0.0020–0.0040 | |
- ※1 Heating Rate: 10℃/min.(Tensile)
- ※2 Measured by cavity resonator.
- ※3 Refer to "Condition Note"
- ※ Above data are experimental results and not guaranteed.
Standard Specifications
Prepreg
| Part Number | Type | Glass Cloth | Properties | |||
|---|---|---|---|---|---|---|
| Style | Resin Content (%) |
Dielectric Thickness after Lamination ※1 |
||||
| GH-100 | (D) | 0.025 | 1017F71K | 1017 | 71±2 | 0.027 mm |
| 1017F73K | 73±2 | 0.029 mm | ||||
| 1017F75K | 75±2 | 0.031 mm | ||||
| 1017F77K | 77±2 | 0.034 mm | ||||
| 1017F79K | 79±2 | 0.038 mm | ||||
| GH-200 | (D) | 0.020 | 1010F72K | 1010 | 72±2 | 0.019 mm |
| 1010F74K | 74±2 | 0.021 mm | ||||
| 1010F76K | 76±2 | 0.023 mm | ||||
| 1010F78K | 78±2 | 0.025 mm | ||||
| 1010F80K | 80±2 | 0.028 mm | ||||
| 1010F82K | 82±2 | 0.031 mm | ||||
| 1010F84K | 84±2 | 0.035 mm | ||||
| 0.025 | 1017F68K | 1017 | 68±2 | 0.020 mm | ||
| 1017F70K | 70±2 | 0.022 mm | ||||
| 1017F72K | 72±2 | 0.024 mm | ||||
| 1017F74K | 74±2 | 0.026 mm | ||||
| 1017F76K | 76±2 | 0.028 mm | ||||
| 1017F78K | 78±2 | 0.031 mm | ||||
| 1017F80K | 80±2 | 0.034 mm | ||||
| 1017F82K | 82±2 | 0.038 mm | ||||
| 1017F84K | 84±2 | 0.043 mm | ||||
| 0.030 | D1027F66K | 1027 | 66±2 | 0.031 mm | ||
| D1027F68K | 68±2 | 0.033 mm | ||||
| D1027F70K | 70±2 | 0.035 mm | ||||
| D1027F72K | 72±2 | 0.038 mm | ||||
| D1027F74K | 74±2 | 0.041 mm | ||||
| D1027F76K | 76±2 | 0.045 mm | ||||
| D1027F78K | 78±2 | 0.049 mm | ||||
※1) The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. Values change depending on the press condition or inner layer pattern.
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