MCL-HS100

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material

About the product

  • Product
    CCL

    MCL-HS100

    Prepreg

    GH-100

  • Applications
    • Semiconductor packages (FC-CSP, PoP, SiP)
    • Thinner Module PWB

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Features

  • MCL-HS100 has hybrid properties of package and high speed materials.
  • MCL-HS100 has low CTE value in X, Y directions and good dielectric property. (Dk 3.7, Df 0.0040 at 10 GHz)
  • MCL-HS100(Type D) achieved low dielectric constant (3.4 at 10 GHz) and low dissipation factor (0.0025 at 10 GHz) using low Dk glass.
  • Well-suited for build-up construction.

Characteristics

Warpage of Coreless 5-layer

Warpage of coreless-5 layer

TEG Chip
  • Package size: 14 mm×14 mm
  • Chip size: 7.3 mm×7.3 mm
  • Chip thickness: 150 µm
  • Underfill thickness: 60 µm (CEL-C-3730-4)
TEG Substrate
  • L1, 5: 12 µm Cu100%, L2, 3, 4: No copper, SR: -
Prepreg construction
  • GH-100 (Type D) (1078, R.C.63%)×4 ply
  • GEA-700G (1078, R.C.66%)×4 ply
  • GEA-705G (1078, R.C.65%)×4 ply
 
Warpage of coreless-5 layer

Transmission Loss

Transmission Loss

Measurement conditions

  • Evaluation PWB: Strip-line
  • Temperature & Humidity: 25℃/60%RH
  • Characteristic impedance: Approx.50Ω
  • Proofreading method: TRL (Thru-Reflect-Line)
  • Trace width(w): 0.12–0.14 mm
  • Dielectric thickness(b): 0.25 mm
  • Trace thickness(t): 18 µm
Transmission Loss

Copper Clad Laminate

                                                                                                                                                                                                                      (t0.2, t0.4mm)

Item Condition ※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-HS100 MCL-HS100 (Type D)
Tg TMA method A ℃ 240–260 2.4.24
DMA method A 240–260 ‐
CTE ※1 X (30–120℃) A ppm/℃ 6–8 ‐
Y (30–120℃) A 6–8
Z (＜Tg) A 20–30 2.2.24
(＞Tg) 130–180
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T-260 (Without copper) A min. ≧60 2.4.24.1
T-288 (Without copper) A ≧60
Decomposition Temperature (TGA method 5% weight loss) A ℃ 430–450 2.3.40
Copper Peel Strength 12 µm A kN/m 0.5–0.7 2.2.8
18 µm A 0.5–0.7
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) A GPa 23–28 2.4.4
Dielectric Constant 10 GHz※2 A ‐ 4.0–4.2 3.3–3.5 IEC-62810
Dissipation Factor 10 GHz※2 A ‐ 0.0050–0.0060 0.0025–0.0035
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1013–1×1015 ‐
  • ※1 Heating Rate: 10℃/min.(Comp.)
  • ※2 Measured by Cavity Resonator.
  • ※3 Refer to "Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-HS100 ‐ 3 μm (LP)
12, 18 μm (LP, RT, HVLP)		 U0.04 0.04 mm
3 μm (LP)
12, 18, 35 μm (LP, RT, HVLP)		 M0.06 0.06 mm
0.1 0.10 mm
0.2 0.20 mm
0.41 0.40 mm
(D) 3 μm (LP)
12, 18 μm (LP, RT, HVLP)		 U0.04 0.04 mm
3 μm (LP)
12, 18, 35 μm (LP, RT, HVLP)		 M0.06 0.06 mm
0.1 0.10 mm
0.2 0.20 mm
0.41 0.40 mm

Note 1)  LP/HVLP: Low profile copper foil.

Note2）Laminate thickness means dielectric layer thickness.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1
GH-100 (D) 0.025 (See [GH-100(Type D) --- ] page for ultra thin, flat prepregs)
‐ 0.03 (1027N71) 1027 71±2 0.042 mm
0.05 (1037N71) 1037 71±2 0.050 mm
0.06 (1078N61) 1078 61±2 0.071 mm
0.1 (2116N55) 2116 55±2 0.130 mm
(D) 0.03 (D1027N73) 1027 73±2 0.042 mm
0.05 (D1037N74) 1037 74±2 0.051 mm
0.06 (D1078N63) 1078 63±2 0.072 mm
0.1 (D2116N57) 2116 57±2 0.130 mm
Reference (IPC-TM-650) 2.3.16 ‐
  • ※1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.       
  • 　    Values change depending on the press condition or inner layer pattern.

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