MCL-HS200
Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material
About the product
- Product
- CCL
-
MCL-HS200
- Prepreg
-
GH-200
- Applications
- Semiconductor packages (FC-CSP, PoP, SiP)
- Thinner Module PWB
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Features
- MCL-HS200 has hybrid properties of package and high speed materials.
- MCL-HS200 has low CTE value in X, Y directions and good dielectric property (Dk 3.7, Df 0.0040 at 10GHz).
- MCL-HS200(Type D) achieved low dielectric constant (3.4 at 10GHz) and low dissipation factor (0.0025 at 10GHz) using low Dk glass.
- Well-suited for build-up construction.
Characteristics
Warpage of 4 layer board
- TEG Chip
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- Chip size 10 mm×10 mm
- Chip thickness 100 µm
- TEG Substrate
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- Package size 14 mm×14 mm
- L1, 4: 12 µm Cu: 65%, L2, 3No Copper SR: 18 µm
- Core thickness: 45 µm
- Prepreg thickness: 45 µm
Transmission Loss
Measurement conditions
- Evaluation PWB: Strip-line
- Temperture and Humidity: 25℃/60%RH
- Characteristic impedance: Approx. 50Ω
- Proofreading method: TRL(Thru-Reflect-Line)
- Trace width(w): 0.12–0.14 mm
- Dielectric thickness(b): 0.65 mm
- Trace thickness(t): 18 µm
Copper Clad Laminate
- ※1 Heating Rate: 10℃/min.(Comp.)
- ※2 Measured by cavity resonator.
- ※3 Refer to "Condition Note"
- ※ Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
Note1) LP/HVLP: Low profile copper foil.
Note2) Laminate thicknessmeans dielectric layer thickness.
Prepreg
※1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. Values change depending on the press condition or inner layer pattern.
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