MCL-HS200

Halogen Free, High Tg, Low Transmission Loss, Low CTE Multilayer Material

About the product

  • Product
    CCL

    MCL-HS200

    Prepreg

    GH-200

  • Applications
    • Semiconductor packages (FC-CSP, PoP, SiP)　
    • Thinner Module PWB

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Features

  • MCL-HS200 has hybrid properties of package and high speed materials.
  • MCL-HS200 has low CTE value in X, Y directions and good dielectric property (Dk 3.7, Df 0.0040 at 10GHz).
  • MCL-HS200(Type D) achieved low dielectric constant (3.4 at 10GHz) and low dissipation factor (0.0025 at 10GHz) using low Dk glass.
  • Well-suited for build-up construction.

Characteristics

Warpage of 4 layer board

Warpage of 4 layer board

TEG Chip
  • Chip size 10 mm×10 mm
  • Chip thickness 100 µm
TEG Substrate
  • Package size 14 mm×14 mm
  • L1, 4: 12 µm Cu: 65%, L2, 3No Copper SR: 18 µm
  • Core thickness: 45 µm
  • Prepreg thickness: 45 µm
 
Warpage of 4 layer board

Transmission Loss

Transmission Loss

Measurement conditions

  • Evaluation PWB: Strip-line
  • Temperture and Humidity: 25℃/60%RH
  • Characteristic impedance: Approx. 50Ω
  • Proofreading method: TRL(Thru-Reflect-Line)
  • Trace width(w): 0.12–0.14 mm
  • Dielectric thickness(b): 0.65 mm
  • Trace thickness(t): 18 µm
Measurement conditions

Copper Clad Laminate

(t0.2, t0.4mm)

Item Condition ※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-HS200 MCL-HS200 (Type D)
Tg TMA method A ℃ 250–270 2.2.24
DMA method A 330–350 ‐
CTE ※1 X※2(30–120℃) A ppm/℃ 8–10 ‐
Y ※2(30–120℃) A 8–10
Z (＜Tg) A 25–35 2.2.24
(＞Tg) 140–200
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T-260 (Without copper) A min. ≧60 2.4.24.1
T-288 (Without copper) A ≧60
Decomposition Temperature (TGA method 5% weight loss) A ℃ 410–430 2.3.40
Copper Peel Strength 12 µm A kN/m 0.5–0.7 2.2.8
18 µm A 0.6–0.8
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) A GPa 21–26 2.4.4
Dielectric Constant 10GHz ※2 A ‐ 3.6–3.8 3.2–3.4 IEC-62810
Dissipation Factor 10GHz ※2 A ‐ 0.0035–0.0045 0.0020–0.0030
Volume Resistivity C-96/20/65+C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/20/65+C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance C-96/20/65 Ω 1×1014–1×1016 ‐
C-96/20/65+D-2/100 1×1013–1×1014 ‐
  • ※1 Heating Rate: 10℃/min.(Comp.)
  • ※2 Measured by cavity resonator.
  • ※3 Refer to "Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-HS200 ‐ 3 μm (LP)
12, 18 μm (LP, RT, HVLP)		 U0.04 0.04mm
3 μm (LP)
12, 18, 35 μm (LP, RT, HVLP)		 M0.06 0.06mm
0.1 0.10mm
0.2 0.20mm
0.41 0.41mm
(D) 3 μm (LP)
12, 18 μm (LP, RT, HVLP)		 DU0.04 0.04mm
3, 12, 18, 35 μm
(LP, RT, HVLP)		 DM0.06 0.06mm
D0.1 0.10mm
D0.2 0.20mm
D0.41 0.41mm

Note1) LP/HVLP: Low profile copper foil.

Note2) Laminate thicknessmeans  dielectric layer thickness.

Prepreg

Part Number Type Glass cloth Properties
Style Resin content
(%)		 Dielectric Thickness
after Lamination ※1 
GH-200 (D) 0.025 (See [GH-200 (Type D)]  ---  page for ultra thin, flat prepregs)
‐ 0.05 （1037N71） 1037 73±2 0.051 mm
0.05 （1037N77） 1037 77±2 0.061 mm
0.06 （1078N63） 1078 63±2 0.072 mm
0.06 （1078N73） 1078 67±2 0.082 mm
0.08 （3313N60） 3313 60±2 0.110 mm
0.08 （3313N63） 3313 63±2 0.121 mm
（D） 0.05 （D1035N69） 1037 69±2 0.051 mm
0.05 （D1035N73） 1037 73±2 0.059 mm
0.06 （D1035N75） 1035 75±2 0.064 mm
0.06 （D1078N65） 1078 65±2 0.072 mm
0.06 （D1078N69） 1078 69±2 0.083 mm
0.08 （D3313N62） 3313 62±2 0.108 mm
0.08 （D3313N65） 3313 65±2 0.118 mm
Reference（IPC-TM-650） 2.3.16 ‐

※1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.            Values change depending on the press condition or inner layer pattern.

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