MCL-E-795G

Halogen Free, High Tg, High Elastic Modulus and Low CTE material

About the product

  • Product
    CCL

    MCL-E-795G

    Prepreg

    GEA-795G

  • Applications
    • Semiconductor packages. (FC-BGA)
    • Center core of buildup construction.

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Features

  • MCL-E-795G has low CTE value in X, Y directions and can reduce warpage of package significantly.
  • MCL-E-795G (Type LH) has low CTE value.
  • Well-suited for center core of buildup construction.

Characteristics

Warpage Performance [3-2-3 construction]

TEG Chip
  • Die size: 20 mm×20 mm
  • Die height: 775 µm
TEG Substrate
  • Package size: 40 mm×40 mm
  • Core thickness: 0.4 mm / 0.8 mm
  • BU thickness: 20 µm
  • SR thickness: 19 µm
Warpage Performance [3-2-3 construction]
Warpage Performance [3-2-3 construction]
Warpage Performance [3-2-3 construction]
Warpage Performance [3-2-3 construction]

Copper Clad Laminate

(t0.4mm)

Item Condition ※4 Unit Actual value Reference
MCL-E-
795G		 MCL-E-
795G
(Type X)		 MCL-E-
795G
(Type L)		 MCL-E-
795G
(Type LH)		 (IPC-TM-650)
Tg TMA method A ℃ 260–290 2.4.24
DMA method A 315–345 ‐
CTE ※1 X (30–120℃) A ppm/℃ 3.0–5.0 2.0–4.0 1.0–3.5 0.5–3.0 ‐
Y (30–120℃) A 3.0–5.0 2.0–4.0 1.0–3.5 0.5–3.0
Z ※2 (＜Tg) A 10–15 2.4.24
(＞Tg) 70–100
Solder Heat Resistance (260℃) A sec. ＞300 ‐
T-260 (Without Copper) A min. ＞60 2.4.24.1
T-288 (Without Copper) A ＞60
Decomposition Temperature (TGA, 5% weight loss) A ℃ 470–490 2.3.40
Copper Peel strength 12 µm A kN/m 0.7–0.9 2.4.8
18 µm A 0.8–1.0
Flexural Modulus (X) ※2 A GPa 35–37 37–39 39–41 40–42 ‐
 Dielectric Constant 1GHz ※3 A － 4.3–4.5 4.2–4.4 4.1–4.3 4.1–4.3 ‐
Dissipation Factor 1GHz ※3 A － 0.005–0.007 0.005–0.007 0.005–0.007 0.005–0.007 ‐
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015 2.5.17
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1015 ‐
  • ※1 Heating Rate: 10℃/min.
  • ※2 800 μm thickness.
  • ※3 Measured by SPDR.
  • ※4 Refer to "Condition Note"PDFを開く
  • ※ Above data are experimental results and not guaranteed.
  •  

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Thickness code Actual thickness
MCL-E-
795G		 － 12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP)		 M0.06 0.06 mm
0.1 0.11 mm
0.2 0.21 mm
0.41 0.41 mm
0.61 0.61 mm
0.81 0.82 mm
1.01 1.02 mm
1.21 1.23 mm
1.41 1.43 mm
(X) 12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP)		 0.41 0.41 mm
0.61 0.62 mm
0.81 0.82 mm
1.01 1.02 mm
1.21 1.23 mm
1.41 1.43 mm
(L) 12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP)		 0.1 0.11 mm
0.2 0.21 mm
0.41 0.41 mm
0.61 0.62 mm
0.81 0.82 mm
1.01 1.03 mm
1.21 1.24 mm
1.41 1.44 mm
(LH) 12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP)		 D0.15 0.16 mm
0.2 0.21 mm
0.41 0.43 mm
0.61 0.64 mm
0.81 0.85 mm
1.01 1.07 mm
1.21 1.28 mm
1.41 1.49 mm
  • ※1 STD: Standard copper foil, LP: Low Profile copper foil.
  • ※2 The thickness means that of dielectric layer.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1 (mm)
GEA-795G ‐ 0.03 (1027N76) 1027 76±2 0.044
0.04 (1037N76) 1037 76±2 0.053
0.06 (1078N66) 1078 66±2 0.072
(L) 0.03 (L1027N76) 1027 76±2 0.044
0.04 (L1037N76) 1037 76±2 0.053
0.06 (L1280N63) 1280 63±2 0.072
  • ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 0%.

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Solution & Technology