MCL-E-770G (Type R)

Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material

About the product

  • Product
    CCL

    MCL-E-770G (Type R)

    Prepreg

    GEA-770G

  • Applications
    • Semiconductor packages. (FC-CSP, PoP, SiP)
    • Thinner module.

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Features

  • MCL-E-770G has low CTE values in X, Y directions and reduces warpage of package substrate significantly.
  • MCL-E-770G (Type RLH) has lower CTE value (less than 2.0 ppm/℃).

Characteristics

Warpage of FC-CSP

Warpage of FC-CSP

TEG Chip
  • Chip size: 7.3 mm×7.3 mm
  • Chip thickness: 150 µm
  • Underfill thickness: 60 µm (CEL-C-3730-4)
  • Solder Resist thickness: 20 µm (FZ-2700GA)
TEG Substrate
  • Package size: 14 mm×14 mm
  • Core Thickness 200 µm+1024 (S-HD)prepreg
 
Warpage of FC-CSP

Copper Clad Laminate

　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　(t0.2mm)

Item Condition ※3 Unit Actual Value Reference
(IPC-TM-650)
MCL-E-
770G (Type R)		 MCL-E-
770G (Type RLH)
Tg TMA method A ℃ 260–280 2.4.24
DMA method A 300–330 ‐
CTE ※1 X (30–120℃) A ppm/℃ 4.0–6.0 1.5–2.0 ‐
Y (30–120℃) 4.0–6.0 1.5–2.0
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T260 (Without copper) A min. ≧60 2.4.24.1
T288 (Without copper) ≧60
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 430–450 2.3.40
Heat Resistance for HDI Process (Semi-Additive) 260℃ Reflow cycles ≧20 ‐
Copper Peel Strength 12 µm A kN/m 0.7–0.9 2.4.8
18 µm 0.8–1.0
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) ※4 A GPa 30–32 34–36 ‐
Dielectric Constant 10GHz ※2 A ‐ 4.2–4.4 3.9–4.1 -
Dissipation Factor 10GHz ※2 A － 0.006–0.008 0.006–0.008 ‐
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐
  • ※1 Heating Rate: 10℃/min.(Comp.)
  • ※2 Measured by SPDR.
  • ※3 Refer to "Condition Note"PDFを開く
  • ※4 t0.8mm
  • ※t0.4mm thickness core is used depending on test item.
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Code Name Laminate Thickness
MCL-E-770G (R) 2, 3, 12 µm (LP, PF) T0.05 0.05mm
U0.04 0.04mm
2, 3, 12 µm (LP,PF)
12 µm (STD)		 M0.06 0.06mm
M0.11 0.10mm
0.2 0.20mm
(RLH)

2, 3, 12, 18 µm (LP)
2, 3, 12 µm (PF)
12, 18 µm (STD)

 U0.04 0.04mm
M0.06 0.07mm
0.2 0.21mm

Note 1) STD: Standard copper foil, LP: Low profile copper foil, PF: Profile free copper foil.Note 2) Laminate thickness means dielectric layer thickness.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1
GEA-770G - ≦0.025 (See [GEA-770G --- ] page for ultra thin, flat prepregs)
‐ 0.025 (1017N72) 1017 72±2 0.025 mm
0.025 (1017N76) 1017 76±2 0.030 mm
0.03 (1027N72) 1027 72±2 0.040 mm
0.03 (1027N76) 1027 76±2 0.048 mm
0.04 (1037N72) 1037 72±2 0.048 mm
(L) 0.025 (L1017N72) 1017 72±2 0.025 mm
0.025 (L1017N76) 1017 76±2 0.030 mm
0.03 (L1027N72) 1027 72±2 0.040 mm
0.03 (L1027N76) 1027 76±2 0.048 mm
0.035 (L1024N68) 1024 68±2 0.041 mm
0.035 (L1024N73) 1024 73±2 0.050 mm
0.04 (L1037N72) 1037 72±2 0.048 mm
0.045 (L1030N71) 1030 71±2 0.058 mm
Reference (IPC-TM-650) 2.3.16 ‐

※1) The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.            Values change depending on the press condition or inner layer pattern.

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