MCL-E-705G

Halogen Free, High Tg, High Elastic Modulus, Low CTE Multilayer Material

About the product

  • Product
    CCL

    MCL-E-705G

    Prepreg

    GEA-705G

  • Applications
    • Semiconductor packages (FC-BGA, FC-CSP, PoP, SiP)
    • HDI, PWB
    • Thinner module, PWB

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Features

  • MCL-E-705G has low CTE values in X, Y directions and reduces warpage of package substrate significantly.
  • MCL-E-705G(Type L) and MCL-E-705G(Type LH) have lower CTE value s by applying low CTE glass cloths.
  • Well-suited for build-up construction.

Characteristics

Warpage of FC-BGA

Warpage of FC-BGA

TEG Chip
  • Chip size: 20 mm×20 mm
  • Chip thickness: 0.725 mm
  • Bump diameter: 80 µm
  • Bump pitch: 200 µm
TEG Substrate
  • Package size: 35 mm×35 mm
  • Core thickness: 0.4 mm
  • Build up thickness: 30 µm× 2
  • SR thickness: 20 µm
 

Warpage of PKG

Warpage of PKG

TEG Substrate spec
  • Size: 14 mm×14 mm
  • Total thickness: 250 µm
  • SR thickness: 20 µm (SR-7200G)
  • Prepreg thickness: 40 µm
  • Core thickness: 110 µm
 

Copper Clad Laminate

                                                                                                                                                                                           (t0.4 mm)

Item Condition ※4 Unit Actual Value Reference
MCL-E-
705G		 MCL-E-
705G
(Type X)		 MCL-E-
705G
(Type L)		 MCL-E-
705G
(Type LH)		 (IPC-TM-650)
Tg TMA method A ℃ 250–270 2.4.24
DMA method A 295–305 ‐
CTE ※1 X※2 (30–100℃) A ppm/℃ 5–7 4–6 3–4 2.5–3.5 ‐
Y※2 (30–100℃) A 5–7 4–6 3–4 2.5–3.5
Z※5 (＜Tg) A 10–15 2.4.24
(＞Tg) 70–100
Solder Heat Resistance (260℃) A sec. ≧300 ‐
T-260 (Without Copper) A min. ≧60 2.4.24.1
T-288 (Without Copper) A ≧60
Decomposition Temperature (TGA method 5% Weight Loss) A ℃ 430–450 2.3.40
Heat Resistance for HDI Process (Semi-Additive) 260℃ Reflow cycles ≧20 ‐
Copper Peel Strength 12 µm A kN/m 0.8–1.0 2.4.8
18 µm A 0.9–1.1
Surface Roughness (Ra) A µm 2–3 2.2.17
Flexural Modulus (Lengthwise) ※5 A GPa 32–34 33–35 34–36 37–39 ‐
Dielectric Constant 10 GHz ※3 A ‐ 4.4–4.6 4.4–4.6 4.1–4.3 4.1–4.3 ‐
Dissipation Factor 10 GHz ※3 A ‐ 0.009–0.011 ‐
Volume Resistivity C-96/40/90 Ω･cm 1×1014–1×1016 2.5.17
Surface Resistance C-96/40/90 Ω 1×1013–1×1015
Insulation Resistance A Ω 1×1014–1×1016 ‐
D-2/100 1×1012–1×1014 ‐
  • ※1 Heating Rate: 10℃/min.
  • ※2  Tensile.
  • ※3  Measured by SPDR.
  • ※4  Refer to "Condition Note"PDFを開く
  • ※5  t0.8 mm
  • ※ Above data are experimental results and not guaranteed.

Standard Specifications

Copper Clad Laminate

Part Number Type Copper Foil Thickness Thickness Code Laminate Thickness
MCL-E-
705G		 -
(L)		 2 , 3 , 12 µm (LP, PF) T0.06 0.06mm
12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP, PF)		 M0.06 0.06 mm
0.1 0.11 mm
M0.11 0.10 mm
M0.15 0.16 mm
M0.22 0.21 mm
0.2 0.21 mm
0.31 0.31 mm
0.41 0.41 mm
0.51 0.52 mm
0.61 0.62 mm
0.71 0.72 mm
0.81 0.82 mm
(X) 12 µm
18 µm
(STD)
2 µm
3 µm
12 µm
(LP, PF)		 0.41 0.41 mm
0.61 0.62 mm
0.81 0.82 mm
(LH) M0.06 0.06 mm
0.1 0.11 mm
D0.15 0.16 mm
0.2 0.21 mm
0.26 0.26 mm
  • Note1)  STD: Standard copper foil, LP: Low profile copper foil, PF: Profile-free copper foil.
  • Note2) "U" for 1-ply; "T" for 2-ply.
  • Note3)   Laminatethickness means dielectric layer thickness.

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content
(%)		 Dielectric Thickness
after Lamination ※1 
GEA-705G - ≦0.025 (See [GEA-705G --- ] page for ultra thin, flat prepregs)
‐ 0.025 (1017N73) 1017 73±2 0.025 mm
0.03 (1027N73) 1027 73±2 0.039 mm
0.04 (1037N73) 1037 73±2 0.047 mm
0.06 (1078N65) 1078 65±2 0.070 mm
0.1 (2116N58) 2116 58±2 0.126 mm
(L) 0.025 (L1017N73) 1017 73±2 0.025 mm
0.03 (L1027N73) 1027 73±2 0.040 mm
0.04 (L1037N73) 1037 73±2 0.047 mm
0.06 (L1078N65) 1078 65±2 0.071 mm
0.1 (L2116N58) 2116 58±2 0.127 mm
Reference (IPC-TM-650) 2.3.16 ‐
  • ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is within 0%.
  •          Values change depending on the press condition or inner layer pattern.

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