GEA-705G,GEA-770G

Thin Prepreg with Superior Surface Smoothness

About the product

  • Product
    Prepreg

    GEA-705G,GEA-770G

  • Applications
    • Semiconductor packages. (FC-BGA, FC-CSP, PoP, SiP)
    • HDI, PWB
    • Thinner module, PWB

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Features

  • Superior in impedance control as prepreg thickness variation is small after press.
  • Suitable for fine line formation with its smooth surface.
  • Can achieve insulation layer thickness 16 µm.
  • Suitable for coreless structure by superior variation of dimensional change.
  • Undulation of TYPE-F prepreg is small after press. TYPE-F technology can reduce warpage at assembly.

Characteristics

Surface Smoothness of Prepreg (Microscope)

Surface Smoothness of Prepreg (Microscope)

TYPE-F

Surface Smoothness of Prepreg (Microscope)

Conventional

Panel Warpage of Prepreg after press (w/o copper, by shadow moire)

Panel Warpage of Prepreg after press (w/o copper, by shadow moire)

TYPE-F

Panel Warpage of Prepreg after press (w/o copper, by shadow moire)

Conventional

Prepreg thickness after Press

Laminate condition

Sample

  • GEA-705G 1010F78
  • Copper foil: 3 µm
  • Temp.: 230℃100 min
  • Heating rate: 3.0℃/min
  • Pressure: 3 MPa

 

Measurement method
Prepreg thickness after Press
Prepreg thickness after Press

Undulation of prepreg after press (GEA-705G1010F78)

Undulation of prepreg after press (GEA-705G1010F78)

TYPE-F

Undulation of prepreg after press (GEA-705G1010F78)

Conventional

Prepreg

Item Condition ※2 Unit Actual Value Test Method
GEA-705G GEA-770G (IPC-TM-650)
Tg TMA method A 250–270 260–280 2.4.24.5
DMA method A 295–305 200–300 -
CTE ※1 X (30–120℃) A ppm/℃ 8–10 6–8 2.4.24.5
Y (30–120℃) 8–10 6–8
T260 (Without Copper) A min. ≧60 ≧60 2.4.24.1
T288 (Without Copper) ≧60 ≧60
Undulation (After Press) A mm 0.0–0.3 0.0–0.3 -
  • ※1 Heating Rate: 10℃/min.(Tensile)
  • ※2 Refer to"Condition Note"PDFを開く
  • Above data are experimental results and not guaranteed.

Standard Specification

Prepreg

Part Number Type Glass Cloth Properties
Style Resin Content(%)

Dielectric Thickness

after laminate ※1

GEA-705G 0.015 1006F70 1006 70±2 0.016 mm
1006F72 72±2 0.017 mm
1006F74 74±2 0.018 mm
1006F76 76±2 0.020 mm
1006F78 78±2 0.022 mm
0.020 1010F74 1010 74±2 0.021 mm
1010F76 76±2 0.023 mm
1010F78 78±2 0.025 mm
1010F80 80±2 0.027 mm
1010F84 84±2 0.035 mm
0.025 1017F73 1010 73±2 0.025 mm
1017F78 78±2 0.031 mm
1017F83 83±2 0.040 mm
GEA-770G 0.015 1006F74 1006 74±2 0.017 mm
1006F76 76±2 0.019 mm
1006F78 78±2 0.021 mm
1006F80 80±2 0.023 mm
0.020 1010F67 1010 67±2 0.016 mm
1010F69 69±2 0.018 mm
1010F71 71±2 0.019 mm
1010F73 73±2 0.021 mm
1010F78 78±2 0.026 mm
1010F82 82±2 0.032 mm
0.025 1017F73 1017 73±2 0.026 mm
1017F78 78±2 0.033 mm
1017F83 83±2 0.043 mm
0.030 1027F73 1027 73±2 0.042 mm
1027F78 78±2 0.052 mm
Reference(IPC-TM-650) 2.3.16
  • ※1) The dielctric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
    Values change depending on the press condition or inner layer pattern.

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