MCL-E-679FG
Halogen Free, High Elastic Modulus, Low CTE Multilayer Material
About the product
- Product
- CCL
-
MCL-E-679FG
MCL-E-679FGB〈Black Type〉
- Prepreg
-
GEA-679FG
- Applications
- Semiconductor packages. (FC-BGA, BGA, CSP)
- Build up PWB.
- Personal computer, high density electronic equipment.
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Features
- Halogen free material for environmental concerns.
- CTE (Z-direction) is 50% lower than that of our standard FR-4.
- Elastic modulus is 20% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection.
- Superior heat resistance for soldering (suitable for lead free process).
- Suitable for fine patterning with 1/4 surface roughness of our standard FR-4 pattern possible.
Copper Clad Laminate
Through-hole reliability
Test condition: -55℃, 30min. ⇔150℃, 30min.
Pattern: Wall to wall distance 0.3mm, Laminate thickness: t0.8mm
Pre-condition: 260℃ reflow × 2times⇒Solder dipping (260℃ 10sec.)
Stiffness Properties
Prepreg thickness after pattern filling (Inner layer copper 15 µm)
Copper Clad Laminate
- ※1 Heating Rate: 10℃/min.
- ※2 Measured by SPDR method.
- ※3 Refer to"Condition Note"
- ※ Above data are experimental results and not guaranteed.
Standard Specifications
Copper Clad Laminate
- ※1 STD: Standard copper foil, LP: Low profile copper foil,
- ※2 STD: 12 µm, 18 µm, 35 µm; LP: 3 µm, 12 µm, 18 µm.
- ※3 “U” for 1-ply“; T” for 2-ply.
- ※4 The thickness means that of dielectric layer.
Prepreg
- ※1 The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%.
Value changes depending on the press condition or inner layer pattern. - ※2 Black type is not available for prepreg.
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