High reliability die bonding paste for total cost reduction

Die bonding is the process of attaching a chip and substrate. In the past, Au-Si eutectic and soldering were common processing methods, but with the increasing variety of chips and the spread of copper lead frames, the internal stress caused by a mismatch between the thermal expansion coefficients of the chip and the lead frame has become greater, making die bonding pastes able to reduce internal stress indispensable. Since internal stress and chip and substrate adhesion are the major elements of a package’s reliability, it is vital to choose the optimal die bonding paste for each type of package.
Die bonding pastes with epoxy resin as the main component have been commonly used, but conventional epoxy resin pastes require a special sealing resin to ease the internal stress. Substrate surface treatment is also necessary to increase the adhesion.
As a better solution, Resonac proposes its high reliability die bonding paste, EPINAL <EN-4900GC>, which demonstrates low elastic modulus, high adhesive strength, and excellent internal stress reduction performance. The product contributes to reducing the total cost by enabling high reliability die bonding with no extra costs for substrate treatment or other processes.

Innovative Solution

Die bonding paste with low elastic modulus and high adhesive strength realizes greater reliability and total cost reduction

In recent years, semiconductors have come to be used for a wide range of purposes, leading to the development of chips in varying sizes and thicknesses. Larger chips generate greater internal stress, but with the level of elastic modulus of conventional epoxy pastes, a special sealing resin is needed to reduce the internal stress. Dealing with the internal stress is also crucial for thin chips as they can easily warp and come off.
In cases of insufficient adhesiveness, substrate surface treatment is also necessary to ensure firm adhesion.
Resonac’s high reliability die bonding paste, EPINAL <EN-4900GC>, achieves low elastic modulus and high adhesive strength with a hybrid composition of epoxy and acrylic resins and a rubber component. Even with larger chips, our product’s low elastic modulus, superior internal stress reduction performance, and high adhesive strength make high reliability die bonding possible, which contributes to driving down the total cost.
Obtaining Automotive Grade 0 and MSL1 ratings, Resonac’s EPINAL <EN-4900GC> is suitable for QFN communication chips and general-purpose automotive packages. Small chip grades and enhanced heat dissipation grades are also available. Please contact us for more information.

High reliability die bonding paste EPINAL <EN-4900GC>

Product Features

Lower elastic modulus than conventional products

The elastic modulus of EPINAL <EN-4900GC> is lower than conventional epoxy pastes. The internal stress can be reduced without using a special sealing resin.

Elastic modulus comparison

Greater adhesion than conventional products

EPINAL <EN-4900GC> demonstrates greater adhesive strength than conventional epoxy pastes. Firmer adhesion can be achieved without substrate surface treatment.

Die shear strength comparison

• ※The data shown are representative values that represent examples of the results of measurements, calculations, etc., and are not guaranteed values.

Modification date: 17th March, 2023