Solution

A film capable of bonding a low heat-resistant circuit board.
Also contributing to thinning of connections.

Isotropic conductive film

HomeSolutionIsotropic conductive film
Applicable Business Areas
Manufacturers of electronic parts (sensors, connectors), etc.
Target Applications
Strengthening of grounding, terminal bonding

Innovative Solution

Circuit bonding temperature is reduced by 80ºC, allowing for bonding of a low heat-resistant circuit board!

Although solder, which is generally used to bond a circuit board, has a high reliability, it has to be heated to its melting point (200ºC or more) for bonding. For this reason, it is necessary to select a high heat-resistant circuit board material. An isotropic conductive film we have developed allows for bonding of circuit boards under the temperature around 120ºC and at atmospheric pressure. Therefore, it is possible to bond a resin circuit board such as PET which is low heat-resistant and difficult to bond when solder is used.

Our film solution contributes to thinning of connections

While advanced electronic devices such as smartphones become thinner and lighter, they are equipped with various functions. Therefore, it is necessary to mount many electronic parts including sensors, and it is important to consider how to secure spaces for such parts. The thickness of our isotropic conductive film is several tens of micrometers, contributing to the thinning of connections.

Product Features

Reliable bonding to metal electrodes is possible under low-temperature and low-pressure conditions

Our isotropic conductive film allows for bonding using a vacuum laminator under a temperature of around 100ºC and a pressure of 0.1 MPa. Furthermore, this film has a high bonding reliability as it includes a thermosetting resin with excellent heat resistance and mechanical strength as well as conductive particles having a special shape.

General properties

Item

Unit

Property

Resin type

Thermosetting resin

Thickness

µm

25

Carrier film

PET

Bonding conditions

Temperature

100 or more

Pressure

MPa

0.1 or more

Time

s

Up to 20

CTE

α1

ppm/deg.C

35

α2

ppm/deg.C

85

Elastic modulus (25 deg.C)

GPa

2.3

An electrode terminal having an oxide film can be bonded without flux. No bonding material (film) comes out.

A metal terminal having an oxide film such as aluminum can be bonded using a vacuum laminator and without flux. Moreover, no bonding material (film) comes out after bonding thanks to its excellent dimension stability, resulting in space saving between parts mounted on the circuit board.