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Events & Exhibition

JPCA Show 2022

Dates June 15th (Wed) - 17th (Fri) 2022 10:00-17:00
Location Tokyo Big Site, Japan East Hall 5 (5D-04)
  • Base Materials for Packages
  • Base Materials for ICT Infrastructure / IoT Applications
  • Base Materials for Automotive ADAS Applications
  • Photosensitive Materials for Fine Patterning
  • Photosensitive Insulating Materials for Packages
  • Packaging Solution Center
NPI Presentation Introduction of MCL-E-795G. High modulus Low CTE material for Printed Wiring Boards.
Official Web Site

SEMICON Japan Virtual

Dates December 14 to 17, 2020 (Available on demand until January 15, 2021)
Exhibited Porducs * We introduce our products or technoloies in the vertual booth on web
* We exhibit it joining with Showa Denko K.K
  • Materials for Advanced Packages
  • Materials for SiP/AiP/sensor, Under-fill film, Base materials for substlate, Photosensitive materials, Isotropic conductive film
  • Process materials and equipment for wafer process
    High purity gases, High purity solvents, PFC gas scrubber, CMP slurry
  • Materials for Power Device
    SiC epitaxial wafer, Cooling device/material, Sintering Cu paste, Insulating materials, and others
  • Open Innovation in our Packaging Solution Center
Official Web Site

12th Int'l Automotive Electronics Technology Expo (in AUTOMOTIVE WORLD2020)

Dates Jan. 15 (Wed) - 17 (Fri), 2020
Venue & Booth No. Tokyo Big Sight, Japan
  • Traction motor materials
  • Lithium-ion battery materials
  • Power module materials
  • Noise & vibration management device and materials
  • Semiconductor packaging materials
  • Base materials for PWB
  • Others
Official Web Site