Exhibited Porducs |
* We introduce our products or technoloies in the vertual booth on web
* We exhibit it joining with Showa Denko K.K
- Materials for Advanced Packages
- Materials for SiP/AiP/sensor, Under-fill film, Base materials for substlate, Photosensitive materials, Isotropic conductive film
- Process materials and equipment for wafer process
High purity gases, High purity solvents, PFC gas scrubber, CMP slurry
- Materials for Power Device
SiC epitaxial wafer, Cooling device/material, Sintering Cu paste, Insulating materials, and others
- Open Innovation in our Packaging Solution Center
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