- 2024.05.15 Management / IR Consolidated Financial Statements for the first quarter ended March 31, 2024
- 2024.05.15 Management / IR Consolidated Financial Results, First Quarter 2024: Presentation Material
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2024.05.07
R&D
Resonac Participates Semiconductor Assembly Test Automation and Standardization Research Association (SATAS)
~ SATAS accelerates development of technologies for leading-edge semiconductor packaging by utilizing expertise and experience in leading-edge packaging ~ - 2024.04.25 Sustainability Resonac Makes a Donation to Help People Recover from the Damage Caused by Earthquake in Eastern Taiwan
- 2024.04.23 Management / IR Notice on Determination of Terms of Issue of Zero Coupon Convertible Bonds Due 2028
- 2024.05.15 Management / IR Consolidated Financial Statements for the first quarter ended March 31, 2024
- 2024.05.15 Management / IR Consolidated Financial Results, First Quarter 2024: Presentation Material
- 2024.04.23 Management / IR Notice on Determination of Terms of Issue of Zero Coupon Convertible Bonds Due 2028
- 2024.04.23 Management / IR Notice Regarding Issuance of Zero Coupon Convertible Bonds Due 2028
- 2024.04.16 Management / IR Resonac Revises Forecast of Consolidated Performance
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2024.03.29
Business
Resonac Increases Capacity to Produce Materials for AI Chips
~ Resonac invests 15 billion yen in facilities to produce non-conductive film and thermal conductive sheet ~ -
2024.03.28
Business
Resonac Starts to Consider Recycling Plastic Waste Emitted from Semiconductor Manufacturing Process and Reusing It as Gases for Semiconductor Manufacturing
~ Resonac reuses plastic waste by utilizing the company’s plastic chemical recycling technology ~ -
2024.02.08
Business
Resonac’s Patent on Magnetic Molding Compound for Inductors Upheld
- The product contributes to better reliability and magnetic properties in inductors for ADAS, memory modules, and smartphones - - 2024.01.24 Business Resonac Filed Patent Infringement Lawsuit on Photosensitive Films for Semiconductor Package Substrates and High-density Electronic Circuit Boards
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2023.12.13
Business
Resonac Contracts with Nippon Yusen and JERA to Make Joint Effort to Realize Supply of Ammonia Fuel to a Tugboat
-Aiming to Contribute to Decarbonization of Marine Transport-
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2024.05.07
R&D
Resonac Participates Semiconductor Assembly Test Automation and Standardization Research Association (SATAS)
~ SATAS accelerates development of technologies for leading-edge semiconductor packaging by utilizing expertise and experience in leading-edge packaging ~ -
2024.03.21
R&D
JAXA Adopts Resonac’s Proposal to Study Heat Storage and Utilization System for Use on the Lunar Surface
~ Creation from employees’ voluntary activities themed on cosmic materials ~ -
2024.03.07
R&D
Participants in the ISES Japan Summit Visit Resonac’s Semiconductor Backend Process R&D Base
-Semiconductor companies’ executives and leaders of academia and research institutions visited Resonac’s Packaging Solution Center- -
2024.01.18
R&D
Resonac Develops an Original Generative AI, “Chat Resonac,” That Utilizes Accumulated In-house Materials Including Handwritten Documents
-Aiming to mediate between different generations and sections by utilizing generative AI- -
2023.12.21
R&D
Resonac Dramatically Reduces Materials Development Time Using AI Based on Deep Learning Technology
—Resonac has developed a cheminformatics application that increases the speed of physical property calculations thousands of times faster than before—
- 2024.04.25 Sustainability Resonac Makes a Donation to Help People Recover from the Damage Caused by Earthquake in Eastern Taiwan
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2024.03.13
Sustainability
Resonac Launches “Resonac Pride Products and Services” System Aiming to Visualize Their Contribution to the Welfare of Customers and Society by Adopting Various Stakeholders’ Viewpoints
~ Resonac recognizes “Kawasaki Plastic Chemical Recycling Business (KPR)” as the first Resonac Pride Service ~ -
2023.12.20
Sustainability
Resonac held its first Sustainability Meeting
- CEO Takahashi, CFO Somemiya, CHRO Imai, new CSuO Matsuko, outside director Tsuneishi, and field leaders gathered to discuss the current and future progresses/challenges- -
2023.09.14
Sustainability
Resonac Introduces Value Creation Story Starting from Its Purpose under the Key Concept “Here We Go”
-Resonac Publishes RESONAC REPORT 2023, the Group’s First Integrated Report- -
2022.11.02
Sustainability
Showa Denko Establishes Integrated Data Pipeline to Collect, Format, and Accumulate Experimental Data and Analyze Them with AI
- SDK has established data pipeline utilizing electronic lab notebooks. In less than a year of operation, there have already been some cases in which the data pipeline has shortened the product development period by two months -
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2024.03.11
Other
Resonac Group Introduces Newly Designed Uniform Worldwide
~ Resonac decided on functions and design of new uniform by employee vote and hearing at 63 business bases inside and outside Japan ~ - 2024.02.26 Other Notice of Convocation of the 115th Ordinary General Meeting of Shareholders
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2023.10.11
Other
Resonac Participates WIPO GREEN, a Global Platform for Environment-friendly Technologies
—Resonac accelerates co-creative innovation through registration of environmental technologies including those for plastic chemical recycling— - 2023.05.16 Other Resonac to exhibit at JPCA 2023 (The Total Solution Exhibition for Electronic Equipment 2023)
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2023.04.06
Other
Resonac to Exhibit at PCIM Europe
The leading international exhibition and conference for power electronics in Nürnberg Germany, May 9th-11th
Topics
Products
Resonac makes the most of its technologies pertaining to inorganic, metal, and organic chemistry, and provides individualized products for various fields including energy, environment, information, and electronics industries.
Solutions
We in Resonac propose various effective solutions for the problem-solving in manufacturing and technology development.
- Solution
Resonac’s low-melting glass contains no substances restricted by the EU’s RoHS Directive and enables sealing at low temperatures, thereby contributing to reduced energy consumption in manufacturing of vacuum insulated glass.
- Solution
Resonac’s sintered copper paste is suitable for efficient, high-output, miniaturizable SiC modules. It allows better reliability than sintered silver, while having equivalent thermal conductivity.
- Solution
Used as a sealing material primer, "HIMAL" increases adhesion between the lead frame, semiconductor devices or wires and the sealing material, and reduces internal stress. The reliability of power semiconductors is improved by raising the sealing material’s heat resistance while preventing delamination.
To be a Co-creative Chemical Company
We are committed to co-creating a better society together with stakeholders who share our ideas, ranging from consumers to industry leaders.
As a "Co-creative Chemical Company," Resonac will "Change society through the power of chemistry."
Sustainability
Resonac promotes innovations through cooperation and co-creation with its customers and partners, thereby achieving the newly integrated company’s Purpose: “Change society through the power of chemistry.”